ABOUT THE EVENT
Registration is now open for the Fourth ASTM Symposium on Structural Integrity of Additive Manufactured Materials and Parts, to be held on October 7-10, 2019. The symposium is sponsored by ASTM Additive Manufacturing Center of Excellence (AM CoE) and co-sponsored by technical committees:
B09 Metal Powders and Metal Powder Products
D30 Composite Materials
E07 on Nondestructive Testing
E08 on Fatigue and Fracture
F04 on Medical and Surgical Materials and Devices
F42 on Additive Manufacturing Technologies
Additionally, the symposium is supported by the National Institute of Standards and Technology (NIST), Federal Aviation Administration (FAA), Food & Drug Administration (FDA) and European Structural Integrity Society (ESIS) TC15.
To ensure the structural integrity of additively manufactured parts, there is a need for establishing process-structure-property-performance relationships; specifically, where these components and structures are being used in safety critical applications. This event will provide a forum for the exchange of ideas regarding the structural integrity of parts fabricated using additive manufacturing with a focus on the lack of industry standards, design principals, as well as qualification and certification challenges. The materials of interest include metals, polymers, composites, and ceramics. This event is designed for professionals within the AM community including industry, academia and government agencies.
Online registration is now open and will close on October 2nd, 2019. The fees to attend this workshop are listed below.
Early Registration by September 1st:
ASTM Members: $600.00
Scientific Committee and Invited Speakers: $450.00
America Makes Members: $650.00
Regular Registration after September 1st:
ASTM Members: $700.00
Scientific Committee and Invited Speakers: $550.00
America Makes Members: $750.00
Topics for the symposium include, but are not limited to:
Feedstock and materials related effects
Effect of influencing factors (surface, geometry, post-processing, etc.)
Process optimization to improve the performance
Microstructure-property predictive models
Multiscale modeling of the mechanical behavior
Fatigue, fracture, tensile, wear, corrosion, creep of fabricated materials
Effect of anomalies and acceptance criteria
Nondestructive evaluation and inspection issues
Applicability of existing test methods
Development of new test methods
Special requirements for sector specific standards
Qualification and certification challenges
Sessions will be organized based on sector specific applications defined in the newly created F42 sub-committee that captures below sectors:
The language of the symposium will be English.
To participate in the symposium, authors must submit a 200-250 word preliminary abstract using the online Abstract Submittal Form no later than May 31th, 2019.
Student papers will be automatically entered into the ASTM AM COE Student Presentation Competition
Student will be reimbursed for their accommodation up to $1,000 per room (each two students should share a room and for up to 4 nights)
The 1st, 2nd and 3rd place winners will receive $500, $300, $200 honorarium respectively and a plaque.
The resulting publication of this symposium will be a volume of Selected Technical Papers (STP). All submitted papers will be peer-reviewed to determine their acceptance into the STP. Upon publication, a DOI number will be assigned to each manuscript, and therefore, all papers will be listed on the major indexes and are citable.
Each symposium participant will receive a copy of the STP book in mail. Each corresponding author should also expect to receive two manuscripts to review.
Submitting a paper to STP for student presentations is optional.
For more information and abstract submittal please visit www.amcoe.org/symposium. You can email email@example.com for any additional question that you might have.
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Additional information about the symposium is available from the Symposium Co-Chairmen:
2019 Scientific & Technical Committee (STC):
Anil Sachdev, General Motors
Ben Dutton, MTC
Charles Park, Boeing
Chee Kai, SUTD
Chris Holshouser, NIAR
Doug Wells, NASA
Filipo Berto, NTNU
Frank Medina, EWI
Johannes Gumpinger, ESA
John Slotwinski, The Johns Hopkins University Applied Physics Laboratory
Matthew DiPrima, FDA
Matthew Donovan, Oerlikon
Michael Gorelik, FAA
Mohsen Seifi, ASTM International
Nik Hrabi, NIST
Nima Shamsaei, Auburn University
Rachael Andrulonis, NIAR
Rod McMillan, Johnson & Johnson
Stefano Beretta, Polytechnic of Milan
Steve Daniewicz, UA
Thomas Niendorf, University of Kassel
Tony Thornton, Micromeritics Instrument
Richard Russel, NASA
The Defense TechConnect Innovation Summit, co-located with the SBIR/STTR Innovation Summit, is the premier annual event connecting S&T leadership from military, industry and academia with state-of-the-art technology solutions for the national security.
All ASTM attendees are welcome to walk the Innovation Expo in Hall D&E, on Tuesday 3:00 - 6:00 and Wednesday 1:00 - 5:00. Meet directly with SBIR program office leadership at their booths, representing over $3.5 Billion in funding annually. Just show your ASTM badge to enter! For more information visit: https://events.techconnect.org/DTCFall/index.html